Izdelki za stroji za rezanje (47)

3DMicromac‘s microCELL™ TLS is a highly productive laser system for separation of standard silicon solar cells into half cells. The microCELL™ TLS meets cell manufacturers‘ demands by retaining the mechanical strength of the cut cells. The ablation free process guarantees an outstanding edge quality. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the full scale manufacturing of crystalline half cells. The microCELL™ TLS system offers half cell and stripe cutting for improved module performance. The TLSTechnology™ has gained importance in contrast to conventional separation techniques due to smooth and defect free cutting edges. This leads to a significant higher module power gain and less module power degradation.

3DMicromac’s brand new microCETI™ uses the most innovative LIFT (Laser Induced Forward Transfer) laser process, which is an essential factor in the process chain for manufacturing microLED displays. The fully integrated laser system is characterised by its compact footprint and high variability. The microCETI™ enables the transfer of hundreds of millions of microLEDs without the use of mechanical forces, thereby ensuring that microLEDs of almost any shape and size can be transferred. This ensures cost-effective production of microLED displays. Most cost-effective production of microLED displays Unique LIFT module Highest transfer rate ten times faster than competing technologies Flexible software for integration into production lines Handling options for wafers (up to 8″) and sheets (up to Gen.2)

Anwendungen: - Laserschneiden, Dicing und Filamentieren - Laserbohren sowohl im Trepanier- als auch Perkussionverfahren - Lasermikrostrukturierung und -Ablation, z.B. mittels FSLA - Laser-Mikrogravur sowohl an der Substratoberfläche aber auch als Innengravur in transparenten Materialien - Laser-Lift-Off mittels DPSS Laser und Scannersystemen Materialien: Keramiken, Metalle, Polymere, Glaswerkstoffe, Halbleiter, Verbundmaterialien

The microVEGA™ xMR system provides high throughput laser annealing for monolithic magnetic sensor formation. A highly flexible tool configuration, the microVEGA™ xMR can accommodate both Giant Magnetoresistance (GMR) and Tunnel Magnetoresistance (TMR) sensors, as well as easily adjust magnetic orientation, sensor position and sensor dimension—making it an ideal solution for magnetic sensor production. The microVEGA™ xMR uses on-the-fly spot and variable laser energy to provide selective heating of the pinning layer in each sensor in order to “imprint” the intended magnetic orientation. Magnetic field strength and orientation is adjustable by recipe, while high temperature gradients ensure low thermal impact. This allows sensors to be processed directly next to readout electronics as well as closer together, and enables the production of smaller sensors—freeing up space for processing more devices per wafer.

3DMicromac‘s highly versatile microFLEX™ product family is the all-in-one solution for manufacturing flexible thin films in photovoltaics, electronics, medical devices, displays, and semiconductors. The production systems can handle various substrates, material thicknesses, and types such as polymer films, stainless steel, and thin glass. The microFLEX™ systems combine high precision laser processing with cleaning and packaging technologies, as well as inline quality control. Due to its modular concept, various customized solutions are available, reaching from industrial mass production to pilot lines as well as applied research. High throughput and efficiency on-the-fly processing; high machine uptime; multiple tension controllers; contactless substrate guiding Highest flexibility easy machine layout modification by modular concept Cost advantages Long term security of investment; reasonable cost of ownership; easy to upgrade and modify; different micro environments.

The microPRO™ XS system provides laser annealing with high repeatability and throughput in a versatile system. Combining a state-of-the-art laser optic module with 3DMicromac’s modular processing platform, the microPRO XS is ideally suited for ohmic contact formation (OCF) in silicon carbide (SiC) power devices. The microPRO™ XS for OCF features a UV wavelength diode pumped solid-state (DPSS) laser source with nanosecond pulses and spot scanning to process the entire metalized backside of SiC wafers. It forms ohmic interfaces and cures grinding defects, while preventing the generation of large carbon clusters and heat related damage to the frontside of the wafer. Best in class cost per wafer High throughput – 150mm wafers can be processed in a single step Flexible recipe programming and wide parameter range.

3DMicromac‘s microCELL™ OTF meets cell manufacturers‘ demands for increasing the efficiency of PERC solar cells, by precise surface structuring, low operating costs and highest availability. The system is suitable to process mono and polycrystalline silicon solar cells. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the mass production of crystalline solar cells. The contactless cell handling enables processing without surface defects or microcracks. On-the-fly laser processing with unbeatable cost benefit ratio Contactless wafer handling High throughput and efficiency (> 3.800 wph) Low cost of ownership and CAPEX Upgrade for existing production lines or expansion

Applications: - Excimer Laser-Lift-Off using line-beam systems - Laser drilling and ablation using scanner systems or mask projection - Laser engraving of optical materials - Materials: polymers, polymer compounds, glass materials

Anwendungen: - Excimer Laser-Lift-Off mittels Line-Beam-Systemen - Laserbohren und Ablation mittels Scannersystemen oder Maskenprojektion - Lasergravur von optischen Materialien Materialien: Polymere, Polymerschichtsysteme, Glaswerkstoffe

3DMicromac‘s microMARK™ MCL is a compact and maintenance free DPSS laser system to meet customer’s demand for high quality laser engraving with significantly decreased cost of ownership. The system is utilized for visible, invisible as well as for technical engravings of all kind of spectacle lenses as well as marking of hard and soft contact lenses. The use of a UV DPSS laser source achieves a high quality marking result comparable to excimer laser engravings. High quality laser engraving Accurate contrast adjustment Low investment and operating costs Maintenance free laser source Plug-and-play replacement of main components directly by the customer High quality engraving with accurate contrast adjustment on a variety of spectacle lenses and coatings

The coaxial laser welding head wireXL is expected to expand our product portfolio to a more powerful version from 2023: >> usable with laser powers up to 10 kW, >> built-in sensors for process-related monitoring, > a deflection sensor to protect against damage in the event of collisions or process errors, > an XYZ adjustment unit for precise adjustment of the laser spot – wire input arrangement, > shielding the built-in cover glasses by means of crossjet against splashes, > the reduction of fume contamination on the cover glasses by an integrated downjet and > the possibility to replace the protective glasses by means of interchangeable slides. Special designs are still possible on customer request. Send us your specific request by e-mail!

3DMicromac‘s microSHAPE™ laser system is designed for the processing of large and flat substrates with high accuracy. The highly versatile system allows the combination of different laser processes in a single machine. In addition, it is capable of processing with multiple working heads – this parallel processing makes higher throughputs achievable. microSHAPE™ is an industry proven solution for all kinds of ablative and non-ablative processes. These include cutting, selective removal of thin films, and structuring processes like engraving and marking. The microSHAPE™ system is suitable for machining a variety of materials, e.g. glass, metals, polymer, ceramics, display stacks, and coated substrates. Free form cutting with extraordinary quality Damage free cutting edges Contactless processing enables minimal cost of ownership Cutting speed up to 1.5 m/sec Laser sources according to customer requirements Up to 3 independent beam paths

Applications: - Laser cutting, dicing, and filamentation - Laser drilling – available as trepanning or percussion process - Laser micro structuring and ablation, e.g. with FSLA technology - Laser micro engraving, both on the substrate surface and as sub surface engraving in transparent materials Laser-Lift-Off (LLO) using DPSS laser and scanner systems Materials: ceramics, metals, polymers, glass materials, semiconductors, compound material

The microDICE™ laser micromachining system leverages TLSDicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS Dicing™ enables a clean process, microcrack free edges, and higher resulting bending strength. Capable of dicing speeds up to 300mm per second, the microDICE™ system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300mm wafer capable platform enables a true high volume production process, especially for SiC based devices.

The microMARK™ MCF is a premium engraving system. Using an UV excimer laser results in a superior engraving quality considering all cosmetic aspects – without any heat affection and micro cracks. The system is suitable for marking of all kinds of materials and coatings including highindex, tinted, and coated lenses. The microMARK™ MCF is the right choice for concave or convex as well as for blocked and unblocked lenses. The industryapproved system guarantees maximum throughput and availability. Premiumquality excimer laser marking Technical engraving and branding on all kinds of lenses and coatings UDI marking of hard and soft contact lenses Maximum throughput by automatic handling Superior availability by second laser source

3DMicromac‘s microSTRUCT™ C is a highly flexible laser micromachining system predominantly used in product development and applied research. Superior flexibility makes the system ideally suited for laser structuring, cutting, drilling and welding applications on a variety of substrates, e.g. metals, alloys, transparent and biological material, ceramics and thin film compound systems. The microSTRUCT™ C offers a maximal degree of freedom regarding the positioning of the substrates. Flexible, stable and repeatable machining results Two independent and free configurable working areas with various optical setups Open system concept for the integration of different laser sources High range of software functions (Masterscript) User friendly, flexible, upgradeable system

3DMicromac‘s microPRO™ is an adaptable laser micromachining system mainly used in industrial production. Its high versatility makes the system perfectly suited for industrial laser micromachining tasks such as laser structuring, cutting, and drilling applications. Furthermore, it is suitable for a variety of materials, e.g., metals, alloys, transparent and biological substrates, ceramics, and thin film compound systems. The microPRO™ is available with an automatic handling system for wafers, cassettes, trays, etc The microPRO™ enables the laser processing of various substrates. Due to the integration of different technology modules, the platform can be adapted to customers’ requirements. Configuration packages may include High speed cutting Drilling Engraving Structuring and modification Laser Lift Off (LLO) Cylindrical machining Customized solutions